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US20010013473: Pre-plate treating system


Filing Information

Inventor(s) James Taylor ·
Assignee(s) None listed in document.
Application Number US9779870
Filing date 02/08/2001
Publication date 08/16/2001
Predicted expiration date 01/30/2018
U.S. Classifications 205/118  · 205/210  · 205/133  · 205/317  ·
International Classifications C25D005/02  · C25D005/34  ·
Kind CodeA1
Related U.S. Application DataRELATED APPLICATIONS
0001 This application is a continuation-in-part of Application No. 09/016,048, filed Jan. 30, 1998, now U.S. Pat. No. 6,174,561. This application also claims the benefit of U.S. Provisional Application No. 60/180,917, filed Feb. 8, 2000, under 35 U.S.C. §119(e).
21 Claims, No Drawings


The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a flhn forming amine and sufficient acid to produce a pH of less than 6.5. The acid helps to clean the surface of the substrate, and the film forming amine forms a film on the surface of the substrate. Electroplating proceeds with greatly improved speed and efficiency, especially in low current areas.

Independent Claims | See all claims (21)

  1. 1. A method of electroplating a substrate comprising: providing a solution comprising from about 0.0003% to about 30% of a film forming amine and sufficient acid to produce a pH of less than about 6.5; and coating at least a portion of the substrate with the solution, thereby forming a film on the substrate; and plating the substrate.

References Cited

The current document has no citations.

Patent Family

Document NumberAssigneeInventorsIssue/Pub Date
US20010013473 James Taylor Aug 2001
US6555170 Duratech Industries, Inc. James M. Taylor Apr 2003