Filing Information

Inventor(s)	Setsuo Nakajima · Toshimasa Takeuchi · Junichi Matsuzaki · Satoshi Mayumi · Osamu Nishikawa · Naomichi Saito · Yoshinori Nakano · Makoto Fukushi · Yoshihiko Furuno ·
Assignee(s)	SEKISUI CHEMICAL CO., LTD. ·  View assignee updates
Correspondent	SUGHRUE MION, PLLC ·
Application Number	US12067808
Filing date	09/15/2006
PCT 371 date	03/23/2008
Publication date	09/17/2009
Predicted expiration date	09/15/2026
U.S. Classifications	156/345.44  · 156/345.43  ·
International Classifications	C23F108  ·
Kind Code	A1
PCT Application Number	WO20PCTJP2006318381 - 09/15/2006
Foreign Priority	JP2005275589 - 09/22/2005 · JP2006105122 - 04/06/2006 · JP2006105123 - 04/06/2006 ·

Patent Family

Abstract

In an atmospheric-pressure plasma processing apparatus, a first metal surface 21a of a first stage portion 21 of a stage 20 is exposed and an object to be processed W composed of a dielectric material is placed on the first metal surface 21a. A second stage portion 22 is disposed on a peripheral edge of the first stage portion 21. A solid dielectric layer 25 is disposed on a second metal 24 of the second stage portion 22. A peripheral portion of the object W is placed on an inner dielectric portion 26 of the solid dielectric layer 25. An electrode 11 generates a run up discharge D2 in a second movement range R2 above the second stage portion 22. Then, the electrode 11 is moved to a first movement range R1 above the first stage portion 21 and generates a regular plasma discharge D1.

Independent Claims | See all claims (19)

1. 1. A plasma processing apparatus for processing a surface of an object to be processed which is mainly composed of a dielectric material by exposing said object to a near atmospheric-pressure plasma discharge, said apparatus comprising: a stage including a first stage portion having an exposed first metal surface and a second stage portion having a second metal surface covered with a solid dielectric layer and disposed on an outer peripheral portion of said first stage portion, said object being placed on said first metal surface of said first stage portion such that a peripheral portion of said object is protruded toward said second stage portion; and an electrode relatively movable with respect to said stage within a range including a first movement range in which said electrode is opposed to said first stage portion to generate said plasma discharge and a second movement range in which said electrode is opposed to said second stage portion.
2. 19. An atmospheric-pressure plasma processing apparatus for processing a surface of an object to be processed which is mainly composed of a dielectric material by exposing said object to a near atmospheric-pressure plasma discharge, said apparatus comprising: a stage including a first stage portion having an exposed first metal surface and a second stage portion having a second metal surface covered with a solid dielectric layer and disposed on an outer peripheral portion of said first stage portion, said object being placed on said first metal surface of said first stage portion such that a peripheral portion of said object is protruded toward said second stage portion; a first electrode relatively movable with respect to said stage within a range including a first movement range in which said electrode is opposed to said first stage portion, a second movement range in which said electrode is opposed to said second stage portion and a third movement range located on an opposite side of said second movement range from said first movement range; a second electrode located more to said third movement range side than said first electrode and relatively movable with respect to said stage in unison with said first electrode over a range including said first movement range, said second movement range and said third movement range; a first power supply circuit that starts supplying voltage to said first electrode for said plasma discharge when said first electrode reaches a first predetermined position during an entrance movement in which said first and second electrodes move from said third movement range toward said first movement range via said second movement range, said first predetermined position being located between a position in which said first electrode is located astride said second movement range and said third movement range and a position in which said first electrode is located immediately before said first movement range; and a second power supply circuit that starts supplying voltage to said second electrode for said plasma discharge when said second electrode reaches a second predetermined position during said entrance movement, said second predetermined position being located between a position in which said second electrode is located astride said second movement range and said third movement range and a position in which said second electrode is located immediately before said first movement range.