Boliven Patents - US20090283573: ELECTRODE WIRE MATERIAL AND SOLAR CELL HAVING CONNECTION LEAD WIRE FORMED OF THE WIRE MATERIAL

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US20090283573: ELECTRODE WIRE MATERIAL AND SOLAR CELL HAVING CONNECTION LEAD WIRE FORMED OF THE WIRE MATERIAL

Filing Information

Inventor(s)	Kazuhiro SHIOMI · Toshiaki FUJITA · Masaaki ISHIO ·
Assignee(s)	NEOMAX MATERIALS CO., LTD. · View assignee updates
Correspondent	Neomax Materials Co., Ltd.;c/o Keating & Bennett, LLP ·
Application Number	US12508688
Filing date	07/24/2009
Publication date	11/19/2009
Predicted expiration date	05/19/2024
U.S. Classifications	228/170 ·
International Classifications	B23K3102 ·
Kind Code	A1
Foreign Priority	JP2003144205 - 05/22/2003 ·

Abstract

An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.

Independent Claims | See all claims (7)

1. A method of producing an electrode wire material comprising a core material having a recessed portion arranged to store molten solder along a longitudinal direction thereof and a hot-dip solder plated layer filled in the recessed portion, comprising the steps of: slitting a conductive plate-like material into strip-like materials, with both side end portions of the each strip-like material bended with rotary blades of a slitter to form into the recess portion, whereby obtaining the core materials; and subjecting each of the core materials to a hot-dip solder plating by passing through a molten solder bath to make the recess portion thereof filled with molten solder