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US20090283573: ELECTRODE WIRE MATERIAL AND SOLAR CELL HAVING CONNECTION LEAD WIRE FORMED OF THE WIRE MATERIAL

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Filing Information

Inventor(s) Kazuhiro SHIOMI · Toshiaki FUJITA · Masaaki ISHIO ·
Assignee(s) NEOMAX MATERIALS CO., LTD. ·
Correspondent Neomax Materials Co., Ltd.;c/o Keating & Bennett, LLP ·
Application Number US12508688
Filing date 07/24/2009
Publication date 11/19/2009
Predicted expiration date 05/19/2024
U.S. Classifications 228/170  ·
International Classifications B23K3102  ·
Kind CodeA1
Foreign Priority JP2003144205 - 05/22/2003 ·
7 Claims, 2 Drawings


Abstract

An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.

Independent Claims | See all claims (7)

  1. 1. A method of producing an electrode wire material comprising a core material having a recessed portion arranged to store molten solder along a longitudinal direction thereof and a hot-dip solder plated layer filled in the recessed portion, comprising the steps of: slitting a conductive plate-like material into strip-like materials, with both side end portions of the each strip-like material bended with rotary blades of a slitter to form into the recess portion, whereby obtaining the core materials; and subjecting each of the core materials to a hot-dip solder plating by passing through a molten solder bath to make the recess portion thereof filled with molten solder

References Cited

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Referenced By

Document NumberAssigneeInventorsIssue/Pub Date
US8250744 Hitachi Cable, Ltd. Seigi Aoyama et al. Aug 2012
US8143525 Hitachi Cable, Ltd. Hajime Nishi et al. Mar 2012

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