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US4695527: Radiation-polymerizable composition and process for the application of markings to a printed circuit board

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Filing Information

Inventor(s) Ulrich Geissler · Heide Lampas ·
Assignee(s) Hoechst Aktiengesellschaft ·
Attorney/Agent(s) Schwartz, Jeffery, Schwaab, Mack, Blumenthal & Evans ·
Primary Examiner John E. Kittle ·
Assistant Examiner Cynthia Hamilton ·
Application Number US6875190
Filing date 06/17/1986
Issue date 09/22/1987
Predicted expiration date 03/28/2005
U.S. Classifications 430/256  · 430/312  ·
International Classifications G03C 500  ·
Kind CodeA
International Classifications 430312;327;330;394;319;256;292 ·
Related U.S. Application DataThis is a division of application Ser. No. 717,101, filed Mar. 28, 1985, abandoned.
Foreign Priority DE3412992 - 04/06/1984 ·
18 Claims, No Drawings


Abstract

A photopolymerizable composition is disclosed which comprises: (a) a free-radically polymerizable compound, (b) a polymeric binder, (c) a photopolymerization initiator, (d) a compound which is thermally crosslinkable with the polymeric binder, with a polymerization product of (a) or with itself, and (e) a pigment. The disclosed composition is used for applying markings to printed circuits and preferably is applied to the solder-resist layer using a dry-resist process, is exposed and then developed, either separately or together with the solder-resist layer.

Independent Claims | See all claims (18)

  1. 1. A process for the application of markings to a printed circuit board, comprising the steps of:(i) laminating under pressure a solid thermoplastic photopolymerizable layer onto a supported, imagewise-exposed and developed solder-resist layer of a printed circuit board, said photopolymerizable layer being provided on a transparent, flexible temporary support and comprising(a) a compound which has at least two terminal ethylenically unsaturated groups and which is capable of forming a crosslinked polymer by means of addition chain polymerization initiated by free radicals,(b) a polymeric binder,(c) a radiation-activatable polymerization initiator which forms free radicals,(d) a compound which is thermally crosslinked with at least one from the group consisting of a polymerization product of said compound (a), said polymeric binder (b) and said compound (d) itself, and(e) a finely-divided pigment which is dispersible in said photopolymerizable layer and which contrasts in color with the surface of said printed circuit board;(ii) imagewise exposing said photopolymerizable layer through a negative of said markings;(iii) peeling said temporary support from said photopolymerizable layer; and(iv) treating said photopolymerizable layer in a developer to dissolve unexposed areas of said photopolymerizable layer.
  2. 10. A process for the application of markings to a printed circuit board, comprising the steps of:(i) laminating under pressure a solid thermoplastic photopolymerizable layer onto a supported, imagewise-exposed solder-resist layer of a printed circuit board, said photopolymerizable layer being provided on a transparent, flexible temporary support and comprising(a) a compound which has at least two terminal ethylenically unsaturated groups and which is capale of forming a crosslinked polymer by means of addition chain polymerization initiated by free radicals,(b) a polymeric binder,(c) a radiation-activatable polymerization initiator which forms free radicals,(d) a compound which is thermally crosslinkable with at least one from the group consisting of a polymerization product of said component (a), said polymeric binder (b) and said compound (d) itself, and(e) a finely-divided pigment which is disperible in said photopolymerizable layer and which contrasts in color with the surface of said printed circuit board;(ii) imagewise exposing said photopolymerizable layer through a negative of said markings;(iii) peeling said temporary support from said photopolymerizable layer; and(iv) treating said photopolymerizable layer in a developer to dissolve unexposed areas of said photopolymerizable layer and of said exposed solder-resist layer, respectively.

References Cited

U.S. Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
US3956043 Ciba-Geigy Corporation Zahir et al. May 1976
US4054479 E. I. Du Pont de Nemours and Company Peiffer Oct 1977
US4157407 E. I. Du Pont de Nemours and Company Peiffer Jun 1979
US4425209 Matsushita Electric Industrial Co., Ltd. Saeki et al. Jan 1984
US4438189 Hoechst Aktiengesellschaft Geissler et al. Mar 1984
US4485304 Fuji Photo Film Co., Ltd. Herwig et al. Nov 1984
US4587199 E. I. Du Pont de Nemours and Company Bennett May 1986

Foreign Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
CA1148015HOECHST AGJun 1983
EP0131299E.I. DU PONT DE NEMOURS AND COMPANY (a Delaware corporation)Jan 1985
GB2032939COATES BROTHERS & COMay 1980

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