Filing Information

Inventor(s)	Ulrich Geissler · Heide Lampas ·
Assignee(s)	Hoechst Aktiengesellschaft ·  View assignee updates
Attorney/Agent(s)	Schwartz, Jeffery, Schwaab, Mack, Blumenthal & Evans ·
Primary Examiner	John E. Kittle ·
Assistant Examiner	Cynthia Hamilton ·
Application Number	US6875190
Filing date	06/17/1986
Issue date	09/22/1987
Predicted expiration date	03/28/2005
U.S. Classifications	430/256  · 430/312  ·
International Classifications	G03C 500  ·
Kind Code	A
International Classifications	430312;327;330;394;319;256;292 ·
Related U.S. Application Data	This is a division of application Ser. No. 717,101, filed Mar. 28, 1985, abandoned.
Foreign Priority	DE3412992 - 04/06/1984 ·

Patent Family

Abstract

A photopolymerizable composition is disclosed which comprises: (a) a free-radically polymerizable compound, (b) a polymeric binder, (c) a photopolymerization initiator, (d) a compound which is thermally crosslinkable with the polymeric binder, with a polymerization product of (a) or with itself, and (e) a pigment. The disclosed composition is used for applying markings to printed circuits and preferably is applied to the solder-resist layer using a dry-resist process, is exposed and then developed, either separately or together with the solder-resist layer.

Independent Claims | See all claims (18)

1. 1. A process for the application of markings to a printed circuit board, comprising the steps of:(i) laminating under pressure a solid thermoplastic photopolymerizable layer onto a supported, imagewise-exposed and developed solder-resist layer of a printed circuit board, said photopolymerizable layer being provided on a transparent, flexible temporary support and comprising(a) a compound which has at least two terminal ethylenically unsaturated groups and which is capable of forming a crosslinked polymer by means of addition chain polymerization initiated by free radicals,(b) a polymeric binder,(c) a radiation-activatable polymerization initiator which forms free radicals,(d) a compound which is thermally crosslinked with at least one from the group consisting of a polymerization product of said compound (a), said polymeric binder (b) and said compound (d) itself, and(e) a finely-divided pigment which is dispersible in said photopolymerizable layer and which contrasts in color with the surface of said printed circuit board;(ii) imagewise exposing said photopolymerizable layer through a negative of said markings;(iii) peeling said temporary support from said photopolymerizable layer; and(iv) treating said photopolymerizable layer in a developer to dissolve unexposed areas of said photopolymerizable layer.
2. 10. A process for the application of markings to a printed circuit board, comprising the steps of:(i) laminating under pressure a solid thermoplastic photopolymerizable layer onto a supported, imagewise-exposed solder-resist layer of a printed circuit board, said photopolymerizable layer being provided on a transparent, flexible temporary support and comprising(a) a compound which has at least two terminal ethylenically unsaturated groups and which is capale of forming a crosslinked polymer by means of addition chain polymerization initiated by free radicals,(b) a polymeric binder,(c) a radiation-activatable polymerization initiator which forms free radicals,(d) a compound which is thermally crosslinkable with at least one from the group consisting of a polymerization product of said component (a), said polymeric binder (b) and said compound (d) itself, and(e) a finely-divided pigment which is disperible in said photopolymerizable layer and which contrasts in color with the surface of said printed circuit board;(ii) imagewise exposing said photopolymerizable layer through a negative of said markings;(iii) peeling said temporary support from said photopolymerizable layer; and(iv) treating said photopolymerizable layer in a developer to dissolve unexposed areas of said photopolymerizable layer and of said exposed solder-resist layer, respectively.