Filing Information

Inventor(s)	William L. Kausch · John P. Vikesland ·
Assignee(s)	Minnesota Mining and Manufacturing Company ·  View assignee updates
Attorney/Agent(s)	Donald M. Sell ·
Primary Examiner	Roland E. Martin ·
Assistant Examiner	C. Hamilton ·
Application Number	US6428466
Filing date	09/29/1982
Issue date	07/12/1988
Predicted expiration date	07/12/2005
U.S. Classifications	430/271  · 430/258  ·
International Classifications	G03C 194  ·
Kind Code	A
International Classifications	430258;260;271;271 A;273;286;285;281;533;534;961;277;939;256;257;259;299 ·

Patent Family

Abstract

Dry-film, negative-acting photoresist layers are used in the formation of many articles such as circuit boards, printing plates and the like. Laminable monolayers of photoresist can suffer from slow speeds, brittleness, variable adhesive characteristics, and narrow processing latitude during development and exposure. The use of a crosslinked or crosslinkable integral thermoplastic adhesive laer on the dry-film, negative-acting photoresist layer improves the properties and performance of the photoresist.

Independent Claims | See all claims (9)

1. 1. A dry-film, negative-acting, laminable photoresist of at least two layers comprising:(a) a first layer of a negative-acting photosensitive resist composition comprising (1) an ethylenically unsaturated acrylic or methacrylic polymerizable oligomer, dimer or monomer and (2) a photosensitive free radical generator, said first layer becoming less soluble in an aqueous alkaline solution or organic solvent after exposure to actinic radiation, and(b) a laminable second layer, adjacent and adhered to a surface of said first layer, of a laminable crosslinked or crosslinkable organic polymer which is soluble in an aqueous alkaline solution or organic solvent, wherein said organic polymer comprises an acrylic polymer.
2. 3. A dry-film, negative-acting, laminable photoresist of at least two layers comprising:(a) a first layer of a negative-active photosensitive resist composition comprising an ethylenically unsaturated material and a photosensitive free radical generator, said first layer becoming less soluble in an aqueous alkaline solution or organic solvent after exposure to actinic radiation, and(b) a second layer, adjacent and adhered to a surface of said first layer, of a laminable crosslinked or crosslinkable organic polymer which is soluble in an aqueous alkaline solution or organic solvent, wherein said organic polymer of said second layer comprises a phenol formaldehyde resin and an acrylic polymer.
3. 4. A dry-film, negative-acting, laminable photoresist of at least two layers comprising:(a) a first layer of a negative-acting photosensitive resist composition, said first layer becoming less soluble in an aqeuous alkaline solution or organic solvent after exposure to actinic radiation, and(b) a second layer, adjacent and adhered to a surface of said first layer, of a laminable crosslinked or crosslinkable organic polymer crosslinkable by the applicaiton of heat thereto which is soluble in an aqueous alkaline solution or organic solvent, wherein said organic polymer of said second layer comprises a phenol formaldehyde resin and an acrylic polymer.
4. 5. A dry-film negative-acting, laminable photoresist consisting essentially of two layers comprising:(a) on one surface of said photoresist a first layer of a negative-acting photosensitive resist composition, said first layer becoming less soluble in an aqueous alkaline solution or organic solvent after exposure to actinic radiation, and(b) on the second surface of said photoresist a laminable second layer, adjacent and adhered to a surface of said first layer, of a laminable crosslinked or crosslinkable organic polymer which is soluble in an aqueous alkaline solution or organic solvent wherein said organic polymer of said second layer comprises a phenol formaldehyde resin and an acrylic polymer.
5. 6. A dry-film, negative-acting, laminable photoresist consisting essential of three layers comprising:(a) a first layer of a negative-acting photosensitive resist composition, said first layer becoming less soluble in an aqueous alkaline solution or organic solvent after exposure to actinic radiation,(b) a laminable second layer, adjacent and adhered to a surface of said first layer, of a laminable crosslinked or crosslinkable organic polymer which is soluble in an aqueous alkaline solution or organic solvent, and(c) a strippable carrier layer adhered to said first layer wherein said organic polymer of said second layer comprises a phenol formaldehyde resin and an acrylic polymer.