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US5879285: Aligning means attaching a cable in an imaging apparatus

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Filing Information

Inventor(s) Hiroshi Ishii ·
Assignee(s) Olympus Optical Co., Ltd. ·
Attorney/Agent(s) Armstrong, Westerman, Hattori, McLeland, & Naughton ·
Primary Examiner John P. Leubecker ·
Application Number US8657548
Filing date 06/04/1996
Issue date 03/09/1999
Predicted expiration date 06/04/2016
U.S. Classifications 600/110  · 600/130  ·
International Classifications A61B 105  ·
Kind CodeA
International Classifications 600109;110;112;129;130 ·
Foreign Priority JP7251500 - 09/28/1995 ·
19 Claims, No Drawings


Abstract

An imaging apparatus has a printed-circuit board electrically connected to a solid-state imaging device, and a composite cable electrically connected to said printed-circuit board and made by bundling up a plurality of cables including at least one of plain cables and coaxial cables. An aligner for aligning the plurality of cables contained in the composite cable in a desired form is attached to the distal part of the composite cable. The distal side of the composite cable with the aligner attached to the distal part thereof is opposed to a plane of the printed-circuit board having electrodes. The conductors of the cables of the composite cable and the electrodes on the printed-circuit board are mutually connected all at once directly or indirectly via conducting patterns exposed on the distal side of the aligner. The work of connecting the cables of the composite cable to the electrodes on the printed-circuit board becomes simpler, and a rigid section becomes shorter.

Independent Claims | See all claims (19)

  1. 1. An imaging apparatus, comprising:a solid-state imaging device;a printed-circuit board connected to said solid-state imaging device, said printed-circuit board having a plane part with electrodes;a composite cable having a bundled plurality of cables, with ends of the bundled plurality of cables on a distal side of said composite cable facing the plane part of the printed-circuit board being a distal part; andaligning means having at least one hole into which the bundled plurality of cables is inserted in a desired aligned form for electrical connection with the electrodes on the plane part of said printed-circuit board.
  2. 14. An imaging apparatus, comprising:a solid-state imaging device;a printed-circuit board connected to said solid-state imaging device, said printed-circuit board having a plane part with electrodes;a composite cable having a bundled plurality of cables in an original arrangement; anda tubular member having a plurality of through holes into which each of the bundled plurality of cables is respectively inserted in the original arrangement for electrical connection with the electrodes on the plane part of said printed-circuit board.
  3. 15. An imaging apparatus, comprising:a solid-state imaging device;a printed-circuit board connected to said solid-state imaging device, said printed-circuit board having a plane part with electrodes;a composite cable having a bundled plurality of cables secured in a circular arrangement with an adhesive and having a cylindrical distal part located at a distal end of said composite cable to be connected to the electrodes of said printed-circuit board, each of the bundled plurality of cables has an inner conductor exposed on an outer circumferential side of the distal part; anda tubular member having a through hole into which the distal part is inserted and having conducting patterns extending from within the through hole onto a distal side of the tubular member facing the plane part of said printed-circuit board, each of the conducting patterns within the through hole are respectively electrically connected to each of the exposed conductors of the bundled plurality of cables of the distal part, the conducting patterns on the distal side of the tubular member are electrically connected with the electrodes on the plane part of said printed-circuit board.
  4. 18. An imaging apparatus, comprising:a solid-state imaging device;a printed-circuit board connected to said solid-state imaging device, said printed-circuit board having a plane part with electrodes;a composite cable having a bundled plurality of cables secured in a rectangular arrangement with an adhesive at a rectangular distal part located at a distal end of said composite cable to be connected to the electrodes of said printed-circuit board, each of the bundled plurality of cables has an inner conductor exposed on opposing sides of the distal part; anda frame having a rectangular through hole into which the rectangular distal part is inserted and having conducting patterns extending from within the through hole onto a distal side of said frame facing the plane part of said printed-circuit board, each of the conducting patterns within the through hole are respectively electrically connected to each of the exposed conductors of the bundled plurality of cables of the distal part, the conducting patterns on the distal side of said frame are electrically connected with the electrodes on the plane part of said printed-circuit board.
  5. 19.19. An imaging apparatus, comprising:a solid-state imaging device;a printed-circuit board connected to said solid-state imaging device, said printed-circuit board having a plane part and a lateral plane part with electrodes;a composite cable having a bundled plurality of cables secured in a single row arrangement with an adhesive at a rectangular distal part located at a distal end of said composite cable opposing the plane part of said printed-circuit board, each of the bundled plurality of cables has an inner conductor exposed on opposing sides of the distal part; anda plate-like frame having a rectangular hole extending along a flatness of said plate-like frame into which the rectangular distal part is inserted and having ditches opened on one side of said plate-like frame over the exposed inner conductors of the bundled plurality of cables at the distal part, the ditches are filled with a conductive material contacting the exposed inner conductors of the bundled plurality of cables, the conductive material at a surface of the ditches are electrically connected with the electrodes on the lateral plane part of said printed-circuit board.

References Cited

U.S. Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
US4745470 Olympus Optical Co., Ltd. Yabe et al. May 1988
US4809680 Olympus Optical Co., Ltd. Yabe Mar 1989
US4993405 Olympus Optical Co., Ltd. Takamura et al. Feb 1991
US5609561 Olympus Optical Co., Ltd Uehara et al. Mar 1997

Foreign Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
JP5161602Jun 1993

Patent Family

Document NumberAssigneeInventorsIssue/Pub Date
US5879285 Olympus Optical Co., Ltd. Hiroshi Ishii Mar 1999
JP3863583 Dec 2006