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US5944585: Use of abrasive tape conveying assemblies for conditioning polishing pads

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Filing Information

Inventor(s) Ronald J. Nagahara · Dawn M. Lee ·
Assignee(s) LSI Logic Corporation ·
Attorney/Agent(s) Beyer & Weaver, LLP ·
Primary Examiner David A. Scherbel ·
Assistant Examiner Shantese McDonald ·
Application Number US8942991
Filing date 10/02/1997
Issue date 08/31/1999
Predicted expiration date 10/02/2017
U.S. Classifications 451/56  · 451/72  ·
International Classifications B24B 100  ·
Kind CodeA
International Classifications 45156;72;304;305;306;443 ·
24 Claims, No Drawings


Abstract

A conveying assembly in a conditioning sub-assembly for conveying a conditioning surface to a polishing pad during conditioning is described. The conveying assembly includes an arm and a guiding component connected to the arm and adapted to guide the conditioning surface about the conveying assembly, thereby allowing another area of the conditioning surface to advance and become available for conditioning.

Independent Claims | See all claims (24)

  1. 1. A conditioning sub-assembly comprising:a conveying assembly for conveying a conditioning surface to a polishing pad during conditioning comprising:an arm; anda guiding component connected to said arm and adapted to guide said conditioning surface about said conveying assembly, thereby allowing another area of the conditioning surface to advance and become available for conditioning;a rear connection component connected to said arm at a rear end of said conveying assembly; anda pivoting arm connected to said rear connection component that functions as a pivoting connection about which the pivoting arm and the conveying assembly can pivot.
  2. 15. A process for conditioning a polishing pad comprising:providing a conditioning sub-assembly includinga conveying assembly for conveying a conditioning surface to a polishing pad during conditioning comprising:an arm; anda guiding component connected to said arm and adapted to guide said conditioning surface about said conveying assembly, thereby allowing another area of the conditioning surface to advance and become available for conditioning;contacting said conditioning surface of said conveying assembly with said polishing pad; andoscillating said conveying assembly on said polishing pad.

References Cited

U.S. Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
US3744188 SHARPLESS S Sharpless Jul 1973
US4347689 Verbatim Corporation Hammond Sep 1982
US4671018 Ekhoff Jun 1987
US5081051 Intel Corporation Mattingly et al. Jan 1992
US5216843 Intel Corporation Breivogel et al. Jun 1993
US5536202 Texas Instruments Incorporated Appel et al. Jul 1996
US5547417 Intel Corporation Breivogel et al. Aug 1996
US5643044 Lund Jul 1997

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