Filing Information

Inventor(s)	Ronald J. Nagahara · Dawn M. Lee ·
Assignee(s)	LSI Logic Corporation ·  View assignee updates
Attorney/Agent(s)	Beyer & Weaver, LLP ·
Primary Examiner	David A. Scherbel ·
Assistant Examiner	Shantese McDonald ·
Application Number	US8942991
Filing date	10/02/1997
Issue date	08/31/1999
Predicted expiration date	10/02/2017
U.S. Classifications	451/56  · 451/72  ·
International Classifications	B24B 100  ·
Kind Code	A
International Classifications	45156;72;304;305;306;443 ·

Patent Family

Abstract

A conveying assembly in a conditioning sub-assembly for conveying a conditioning surface to a polishing pad during conditioning is described. The conveying assembly includes an arm and a guiding component connected to the arm and adapted to guide the conditioning surface about the conveying assembly, thereby allowing another area of the conditioning surface to advance and become available for conditioning.

Independent Claims | See all claims (24)

1. 1. A conditioning sub-assembly comprising:a conveying assembly for conveying a conditioning surface to a polishing pad during conditioning comprising:an arm; anda guiding component connected to said arm and adapted to guide said conditioning surface about said conveying assembly, thereby allowing another area of the conditioning surface to advance and become available for conditioning;a rear connection component connected to said arm at a rear end of said conveying assembly; anda pivoting arm connected to said rear connection component that functions as a pivoting connection about which the pivoting arm and the conveying assembly can pivot.
2. 15. A process for conditioning a polishing pad comprising:providing a conditioning sub-assembly includinga conveying assembly for conveying a conditioning surface to a polishing pad during conditioning comprising:an arm; anda guiding component connected to said arm and adapted to guide said conditioning surface about said conveying assembly, thereby allowing another area of the conditioning surface to advance and become available for conditioning;contacting said conditioning surface of said conveying assembly with said polishing pad; andoscillating said conveying assembly on said polishing pad.