Join
today

Boliven PRO is more than just patent search

  • Build and save lists using the powerful Lists feature
  • Analyze and download your search results
  • Share patent search results with your clients

Patents »

US6086779: Copper etching compositions and method for etching copper

Share

Filing Information

Inventor(s) Craig V. Bishop · John R. Kochilla · Robert J. Durante · George S. Bokisa ·
Assignee(s) McGean-Rohco, Inc. ·
Attorney/Agent(s) Renner, Otto, Boiselle & Sklar ·
Primary Examiner William Powell ·
Application Number US9260169
Filing date 03/01/1999
Issue date 07/11/2000
Predicted expiration date 03/01/2019
U.S. Classifications 216/93  · 216/13  ·
International Classifications C23F 100  ·
Kind CodeA
International Classifications 25279.2;79.4 ·
31 Claims, No Drawings


Abstract

This invention relates to an aqueous etching composition for etching metallic copper comprising (a) an acid, (b) a copper complexing agent, (c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and (d) oxygen wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams/liter of composition. The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic copper also is described.

Independent Claims | See all claims (31)

  1. 1. An aqueous etching composition for etching metallic copper comprising:(a) an acid,(b) a copper complexing agent,(c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and(d) oxygen,wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams per liter of composition.
  2. 12. An aqueous acid etching composition for etching metallic copper comprising:(a) sulfuric acid,(b) a copper complexing agent which is a urea, a thiourea, an amidine or an imidazole-thione,(c) a metal selected from tin, bismuth, or cerium present in its higher positive oxidation state, and(d) oxygen,wherein the concentration of the higher positive oxidation state metal is greater than about 4 grams per liter of composition.
  3. 16. An aqueous etching composition for etching metallic copper comprising:(a) an acid,(b) a copper complexing agent which is a urea, a thiourea, an amidine, or an imidazole-thione,(c) greater than about 4 grams of stannic ions per liter of composition,(d) less than about 2 grams of stannous ions per liter of composition, and(e) oxygen.
  4. 29. A process for preparing an aqueous acid etching composition for etching metallic copper which comprises mixing(a) an acid,(b) a copper complexing agent,(c) a metal capable of having a multiplicity of oxidation states and which is present in the mixture in one of its higher positive oxidation states, which metal forms a composition soluble salt,(d) oxygen, and(e) water, wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams per liter of composition.
  5. 30. A method of regenerating a spent aqueous etching composition used for etching metallic copper comprising:(a) an acid,(b) a copper complex,(c) a metal capable of having a multiplicity of oxidation states and which is present in the composition in one of its higher positive oxidation states, and(d) dissolved oxygen,said process comprising removing the copper complex formed during the etching process by crystallization or by resin exchange.

Patent Family

The current document is not in a family.