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US6234883: Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishing

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Filing Information

Inventor(s) Michael J. Berman · Karey L. Holland ·
Assignee(s) LSI Logic Corporation ·
Attorney/Agent(s) Beyer Weaver & Thomas, LLP ·
Primary Examiner Joseph J. Hail, III ·
Assistant Examiner Dung Van Nguyen ·
Application Number US8942006
Filing date 10/01/1997
Issue date 05/22/2001
Predicted expiration date 10/01/2017
U.S. Classifications 451/286  · 451/443  ·
International Classifications --
Kind CodeB1
International Classifications 451 57 · 451 65 · 451 56 · 451285 · 451286 · 451287 · 451288 · 451290 · 451443 · 451444 ·
14 Claims, 7 Drawings


Abstract

Provided are an apparatus and method for concurrently pad conditioning and wafer buffing on a single station of a CMP apparatus. In a preferred embodiment, the apparatus includes a two-sided conditioning/buffing device having a pad conditioner on one side and a buff pad on the other. In operation, the device is inserted between a polishing pad and a polished wafer following CMP. A differential velocity is developed between the pad conditioner and the polishing pad, for example, by contacting the pad conditioner with a rotating or orbiting polishing pad. Concurrently, the polished wafer is contacted with the buff pad on the other side of the device, and a differential velocity is developed between the two, for example, by rotating the wafer, so that the wafer is buffed. Once conditioning and buffing are completed, the finished wafer is removed from the buffing pad and stored or removed from the CMP apparatus, and the conditioning/buffing device is removed and positioned away from the polishing pad, which is now ready to receive and polish another wafer. This concurrent conditioning and buffing allows all stations on a CMP apparatus to be used for polishing, and improves the through-put of the apparatus.

Independent Claims | See all claims (14)

  1. 1. A device for concurrently pad conditioning and wafer buffing at a single station on a chemical mechanical polishing apparatus, comprising: a positioning mechanism for positioning said device within said apparatus; a body connected to a distal end of said positioning mechanism, said body having upper and lower surfaces; a buffing pad on one of the upper and lower surfaces of said body; and a pad conditioner on the other of the upper and lower surfaces of said body.
  2. 10. A chemical mechanical polishing apparatus, comprising: a wafer carrier; one or more polishing pads, each polishing pad at a polishing station; and a device for concurrently pad conditioning and wafer buffing at a single station on said chemical mechanical polishing apparatus, said device having, a positioning mechanism for positioning said device within said apparatus; a body connected to a distal end of said positioning mechanism, said body having upper and lower surfaces; a buffing pad on the upper surface of said body; and a pad conditioner on the lower surface of said body.
  3. 12. A chemical mechanical polishing apparatus module, comprising: one or more polishing pads, each polishing pad at a polishing station; and a device for concurrently pad conditioning and wafer buffing at a single station on said chemical mechanical polishing apparatus module, said device having, a positioning mechanism for positioning said device relative to said apparatus module; a body connected to a distal end of said positioning mechanism, said body having upper and lower surfaces; a buffing pad on one of the upper and lower surfaces of said body; and a pad conditioner on the other of the upper and lower surfaces of said body.
  4. 13. A device for concurrently performing pad conditioning and a wafer polishing operation at a single station on a chemical mechanical polishing apparatus, comprising: a positioning mechanism for positioning said device within said apparatus; a body connected to a distal end of said positioning mechanism, said body having upper and lower surfaces; a polishing pad on one of the upper or lower surfaces of said body; and a pad conditioner on the other surface of said body.
  5. 14. A means for concurrently pad conditioning and wafer buffing at a single station on a chemical mechanical polishing apparatus, comprising: buffing means on a first side of a support means; pad conditioning means on a second side of said support means; and means for positioning said support means between a semiconductor wafer and polishing pad at a polishing station, said support means and positioning means capable of concurrently pad conditioning and wafer buffing at said polishing station.

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Other Publications

“Avant Gaard 676”, IPEC-Planar Bulletin 4500-104621, 1997.
“Avant Gaard 776”, IPEC-Planar Bulletin 4500-104660, 1997.

Referenced By

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