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US6275043: Test device for testing a module for a data carrier intended for contactless communication

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Filing Information

Inventor(s) Andreas Mühlberger · Johann Vorreiter ·
Assignee(s) U.S. Philips Corporation ·
Primary Examiner Glenn W. Brown ·
Assistant Examiner Wasseem H. Hamdan ·
Application Number US9376863
Filing date 08/18/1999
Issue date 08/14/2001
Predicted expiration date 08/18/2019
U.S. Classifications 324/500  · 340/104.2  · 340/104  · 340/870.31  · 340/101  ·
International Classifications --
Kind CodeB1
International Classifications 324500 · 340 101 · 340 104 · 340 1042 · 34087031 ·
Foreign Priority EP98890248 - 08/21/1998 ·
13 Claims, 4 Drawings


Abstract

A test device (1) for testing a module (2) for a data carrier intended for contactless communication includes a carrier signal generator (14) which is arranged to generate a carrier signal (CS) whereby a test signal (TS) can be generated, a conductive connection being provided between the carrier signal generator (14) and a module (2) to be tested, which connection includes an impedance (31), preferably being a series resistor (31), which is connected directly ahead of a module terminal (5) of the module (2) to be tested, the test device (1) being provided with at least one detection device (34, 35) for determining an analog characteristic value (C, m) of a module (2) to be tested while utilizing the test signal (TS) appearing on an impedance terminal (32) of the impedance (31).

Independent Claims | See all claims (13)

  1. 1. A test device (1) which is arranged to carry out at least one test operation on a module (2) which is constructed for use in conjunction with a data carrier intended for contactless communication and includes an integrated component (4), two module terminals (5, 6) for connection to two transmission means terminals, and includes two test terminals (12, 13), each of which can be brought into contact with a module terminal (5, 6) of a module (2) to be tested, and includes a carrier signal generator (14) whereby a carrier signal (CS) can be generated, and includes a signal path (33) which is situated between the carrier signal generator (14) and at least one test terminal (12) and via which a test signal (TS), corresponding to a carrier signal (CS) output by the carrier signal generator (14), can be applied to the at least one test terminal (12), the load modulation means which are included in the integrated component (4) of the module (2) to be tested being capable of load modulating the test signal (TS) when module terminals (5, 6) of a module (2) to be tested are in contact with the test terminals (12, 13), characterized in that the signal path (33) is constructed so as to be conductive, that an impedance (31) is included in the signal path (33), directly ahead of the at least one test terminal (12), and that at least one detection device (34, 35) is connected to at least one test terminal (12), which detection device is arranged to determine, while utilizing the test signal (TS) that can be applied to the at least one test terminal (12), an analog characteristic value (C, m) of a module (2) to be tested which is in contact with the test terminals (12, 13) by way of its module terminals (5, 6).
  2. 6. A method of manufacturing a module (2) which is constructed for use in conjunction with a data carrier intended for contactless communication and includes an integrated component (4), two module terminals (5, 6) for connection to two transmission means terminals, the module (2) being subjected to a test operation by means of a test device (1) which includes two test terminals (12, 13), in which each module terminal (5, 6) of the module (2) is brought into contact with a test terminal (12, 13) of the test device (1), and in which a carrier signal (CS) is generated by means of a carrier signal generator (14) of the test device (1), and in which a test signal (TS) which corresponds to the carrier signal (CS) output by the carrier signal generator (14) is applied to the at least one test terminal (12) via a signal path (33) which is situated between the carrier signal generator (14) and at least one test terminal (12), and in which the test signal (TS) is load modulated by means of load modulation means included in the integrated component (4) of this module (2), when module terminals (5, 6) of the module (2) are in contact with the test terminals (12, 13), characterized in that the test signal (TS) corresponding to the carrier signal (CS) is applied to the at least one test terminal (12) via a signal path (33) which is constructed so as to be conductive and includes an impedance (31) connected directly ahead of the at least one test terminal (12), and that, utilizing at least one detection device (34, 35), connected at least to one test terminal (12), of the test device (1), an analog characteristic value (C, m) of the module (2) which is in contact with the test terminals (12, 13) by way of its module terminals (5, 6) is detected while utilizing the test signal (TS) that can be applied to the at least one test terminal (12).
  3. 11. A method of simultaneously testing a digital functionality and determining an analog characteristic value of a module intended for use in a data carrier having contactless communication capability, the module having two module terminals for connection to transmission terminals of the data carrier, comprising the steps of: contacting the two module terminals to respective test terminals of a test device; generating a carrier modulated test signal in the test device; applying the carrier modulated test signal to at least one of the test terminals, the carrier modulated test signal testing a digital functionality of the module without contactlessly communicating the carrier modulation test signal to the module; and connecting a detection device to at least one of the test terminals for simultaneously measuring an analog characteristic of the module utilizing the same applied carrier modulated test signal.

References Cited

U.S. Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
US5345231 Mikron Gesellschaft fur Integrierte Mikroelectronik mbH Koo et al. Sep 1994
US6028503* U.S. Philips Corporation Preishuberpflugl et al. Feb 2000
US6091342* U.S. Philips Corporation Janesch et al. Jul 2000
US6097278* U.S. Philips Corporation Arnold et al. Aug 2000
US6112275* Dallas Semiconductor Corporation Curry et al. Aug 2000

Foreign Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
EP0845751TEXAS INSTRUMENTS DEUTSCHLAND GMBHJun 1998
* cited by examiner

Referenced By

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Patent Family

Document NumberAssigneeInventorsIssue/Pub Date
US6275043 U.S. Philips Corporation Andreas Mhlberger et al. Aug 2001
DE69923288 KONINKL PHILIPS ELECTRONICS NV MUEHLBERGER ANDREAS et al. Feb 2005