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Patents »
US6455423: Direct writing of low carbon conductive material
Filing Information
| Inventor(s) |
Eugene P. Marsh ·
|
| Assignee(s) |
Micron Technology, Inc. ·
 View assignee updates
|
| Attorney/Agent(s) |
Mueting, Raasch & Gebhardt, P.A. ·
|
| Primary Examiner |
Caridad Everhart ·
|
| Application Number | US9886332 |
| Filing date | 06/21/2001 |
| Issue date | 09/24/2002 |
| Predicted expiration date | 09/03/2018 |
| U.S. Classifications |
438/674 ·
204/492.21 ·
118/640 ·
438/4 ·
|
| International Classifications |
--
|
| Kind Code | B2 |
| International Classifications |
438 4 ·
438681 ·
438686 ·
438674 ·
438676 ·
438678 ·
427252 ·
427554 ·
118640 ·
118621 ·
20429818 ·
20429802 ·
2504923 ·
2504922 ·
25049221 ·
|
| Related U.S. Application Data | This is a continuation of application Ser. No. 09/146,292, filed Sep. 3, 1998 now U.S. Pat. No. 6,261,850, which is incorporated herein by reference. |
Patent Family
26 Claims, 4 Drawings
Abstract
A method for providing a low carbon and/or low oxygen containing conductive material includes providing a substrate assembly having a surface and providing a stream of a precursor containing conductive material to a region proximate the surface of the substrate assembly where the conductive material is to be deposited. A stream of reaction gas is also provided to the region proximate the surface of the substrate assembly where the conductive material is to be deposited. The reaction gas is one of an oxygen or hydrogen containing gas. A focused beam is scanned over the surface of the substrate assembly in the presence of the stream of precursor containing conductive material and the stream of the reaction gas to deposit the conductive material on the surface. The stream of the precursor containing conductive material may include a stream of a precursor containing one of platinum, palladium, rhodium, ruthenium, chromium, silver, and iridium; preferably platinum. Further, the stream of the reaction gas may include a stream of a reaction gas including at least one gas selected from the group of H2, NH3, O2, O3, NO, N2O, H2O2, and R2O2. The method is particularly advantageous in line repair.
- 1. A method for providing a conductive material, the method comprising:
providing a substrate assembly having a surface;
simultaneously providing a platinum containing precursor and an oxygen containing gas to a region proximate the surface of the substrate assembly where platinum is to be deposited; and
directing a focused beam towards the surface of the substrate assembly in the presence of the platinum containing precursor and the oxygen containing gas in the region proximate the surface of the substrate assembly to deposit the platinum on the surface.
- 4. The method of claim wherein the platinum deposited on the surface is a low carbon platinum, wherein an amount of carbon present in the low carbon platinum is about 1.0 percent or less by weight.
- 6. The method of claim wherein directing a focused beam towards the surface of the substrate assembly comprises directing a focused metal ion beam towards the surface of the substrate assembly.
- 10. A system for use in providing a conductive material, the system comprising:
a chamber in which to position a substrate assembly having a surface;
a precursor delivery system comprising:
a precursor source to provide a platinum containing precursor; and
a precursor delivery apparatus operable to deliver the platinum containing precursor to a region proximate the surface of the substrate assembly where platinum is to be deposited when the substrate assembly is positioned in the chamber; a gas source delivery system comprising:
a gas source to provide an oxygen containing gas; and
a gas delivery apparatus operable to deliver the oxygen containing gas to the region proximate the surface of the substrate assembly where platinum is to be deposited when the substrate assembly is positioned in the chamber;
an apparatus operable to control the precursor delivery apparatus and the gas delivery apparatus such that the platinum containing precursor and the oxygen containing gas are simultaneously delivered to the region proximate the surface of the substrate assembly where platinum is to be deposited when the substrate assembly is positioned in the chamber; and
a focused beam apparatus operable to direct a focused beam towards the surface of the substrate assembly in the presence of the platinum containing precursor and the oxygen containing gas in the region proximate the surface of the substrate assembly to deposit the platinum on the surface when the substrate assembly is positioned in the chamber.
- 19. A method for direct writing a conductive material, the method comprising:
providing a substrate assembly having a surface;
providing a precursor comprising conductive material to a region proximate the surface of the substrate assembly where the conductive material is to be deposited;
providing an oxygen containing gas; and
directing a focused beam towards the surface of the substrate assembly in the presence of the precursor comprising conductive material and an oxygen containing gas proximate the surface of the substrate assembly to form the conductive material on the surface.
References Cited
U.S. Patent Documents
* cited by examiner
Other Publications
| Tao, et al. “Focused ion beam induced deposition of platinum” J. Vac. Sci. Technol. B 8(6) Nov./Dec. 1990 p. 1826-1829.* |
| Blauner, et al. “Focused ion beam fabrication of submicron gold structures” J. Vac. Sci. Technol. b 7(4) Jul./Aug. 1989 p. 609-617.* |
| Abstract, Nogar et al., “Laser deposition and laser modification of high-temperature superconducting thin films” (Mar. 1998). |
| Kwon et al., “Characterization of Pt Thin Films Deposited by Metallorganic Chemical Vapor Deposition for Ferroelectric Bottom Electrodes”, |
| Nanofab focused ion beam system. Description online. FAI, 1998 retrieved on Aug. 6, 1998. Retrieved from the Internet:. |
| Tao et al., “Focused ion beam induced deposition of platinum”, |
Boliven’s Predicted Expiration Date includes in its calculation the number of days of patent term adjustment a U.S. patent is entitled. The Predicted Expiration Date does not, currently, include in its calculation the payment of maintenance fees, the filing of any disclaimer(s), and/or patent term extension, but Boliven is working to include this information in the near future.
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