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US6497613: Methods and apparatus for chemical mechanical planarization using a microreplicated surface

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Filing Information

Inventor(s) Stuart L. Meyer ·
Assignee(s) SpeedFam-IPEC Corporation ·
Attorney/Agent(s) Snell & Wilmer, L.L.P. ·
Primary Examiner M. Rachuba ·
Application Number US9712460
Filing date 11/14/2000
Issue date 12/24/2002
Predicted expiration date 07/07/2017
Patent term adjustment 11
U.S. Classifications 451/41  · 451/288  · 451/287  · 451/307  · 451/63  ·
International Classifications --
Kind CodeB1
International Classifications 451 41 · 451 60 · 451 57 · 451287 · 451288 · 451296 · 451307 · 451305 · 451306 · 451 63 ·
Related U.S. Application DataRELATED APPLICATIONS
This application is a continuation application of U.S. patent application Ser. No. 08/883,404, filed Jun. 26, 1997 and entitled “METHOD AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION USING A MICROREPLICATED SURFACE”.
23 Claims, 9 Drawings


Abstract

An apparatus for chemically and mechanically planarizing a workpiece surface employs a polishing slurry and a microreplicated pad having a surface for planarizing the workpiece surface in the presence of the slurry. The surface of the microreplicated pad has a regular array of structures having a sharp distal apexes which contact the workpiece surface during planarization and which are subject to ablating during planarizing thereby becoming substantially blunt. The workpiece moves in a rotational, orbital or translational motion relative to the microreplicated pad.

Independent Claims | See all claims (23)

  1. 1. An apparatus for chemically and mechanically planarizing a workpiece surface, comprising: a polishing slurry; and a microreplicated pad having a surface for planarizing said workpiece surface in the presence of said slurry, wherein said surface of said microreplicated pad comprises structures having sharp distal apexes which contact said workpiece surface during planarization and which are subject to ablating during planarizing thereby becoming substantially blunt; wherein said workpiece moves in at least one of a rotational, orbital and translational motion relative to said microreplicated pad.
  2. 7. A process for chemical mechanical planarization of a workpiece surface, comprising: providing a microreplicated pad having a surface, wherein said surface of said microreplicated pad comprises structures having sharp distal apexes which contact said workpiece surface during planarization and which are subject to ablating during said planarization thereby becoming substantially blunt; and planarizing said workpiece surface by moving said microreplicated pad in at least one of a rotating, orbiting and translating motion while contacting said workpiece surface.
  3. 10. An apparatus for planarizing a surface of a wafer, comprising: a first roller; a second roller; a microreplicated surface in the shape of an elongated belt held by said first and said second roller wherein said microreplicated surface comprises structures having sharp distal apexes which contact said surface of said wafer during planarization and which are subject to ablating during planarizing thereby becoming substantially blunt; and a holder for pressing the wafer against said microreplicated surface and causing relative motion between the wafer and said microreplicated surface so as to planarize the surface of the wafer.
  4. 13. An apparatus for planarizing a wafer surface, comprising: a first roller; a second roller; a microreplicated surface in the shape of an elongated belt held by the first and the second roller wherein said microreplicated surface comprises a regular array of structures having sharp distal apexes which contact said wafer surface during planarization and which are subject to ablating during said planarizing thereby becoming substantially blunt; a fluid introduced between the wafer surface and the microreplicated surface and adapted to enhance the planarization process; and a holder for pressing the wafer surface against the microreplicated surface and causing relative motion between the wafer surface and the microreplicated surface so as to planarize the wafer surface.
  5. 18. An apparatus for chemically and mechanically planarizing a workpiece surface, comprising: a polishing slurry; and a microreplicated pad having a surface for planarizing said workpiece surface in the presence of said slurry, wherein said surface of said microreplicated pad comprises a regular array of structures having cross-sectional areas; wherein said workpiece moves in at least one of a rotational, orbital and translational motion relative to said microreplicated pad and wherein said cross-sectional areas of said structures increase during continued contact with said workpiece surface thereby causing said structures to perform with said polishing slurry a fine planarization process of the workpiece.
  6. 23. A process for chemical mechanical planarization of a workpiece surface, comprising: providing a microreplicated pad having a surface, wherein said surface of said microreplicated pad comprises a regular array of structures having cross-sectional areas; and planarizing said workpiece surface by at least one of rotating, orbiting and translating said surface of said microreplicated pad while contacting said workpiece surface, wherein said cross-sectional areas of said structures increase during continued contact with said workpiece surface thereby causing said structures to perform with a polishing slurry a fine planarization process of the workpiece.

References Cited

U.S. Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
US4576850 Minnesota Mining and Manufacturing Company Martens Mar 1986
US4805348 Speedfam Co., Ltd. Arai et al. Feb 1989
US5099614 Speedfam Co., Ltd. Arai et al. Mar 1992
US5107626 Minnesota Mining and Manufacturing Company Mucci Apr 1992
US5152917 Minnesota Mining and Manufacturing Company Pieper et al. Oct 1992
US5304223 Minnesota Mining and Manufacturing Company Pieper et al. Apr 1994
US5329732 Speedfam Corporation Karlsrud et al. Jul 1994
US5335453 Commissariat a l'Energie Atomique Baldy et al. Aug 1994
US5366523 Minnesota Mining and Manufacturing Company Rowenhorst et al. Nov 1994
US5378251 Minnesota Mining and Manufacturing Company Culler et al. Jan 1995
US5441598 Motorola, Inc. Yu et al. Aug 1995
US5443415* International Technology Partners, Inc. Shebanow et al. Aug 1995
US5454844* Minnesota Mining and Manufacturing Company Hibbard et al. Oct 1995
US5489233 Rodel, Inc. Cook et al. Feb 1996
US5498196 Speedfam Corporation Karlsrud et al. Mar 1996
US5498199 Speedfam Corporation Karlsrud et al. Mar 1996
US5500273 Minnesota Mining and Manufacturing Company Holmes et al. Mar 1996
US5549961 Minnesota Mining and Manufacturing Company Haas et al. Aug 1996
US5560745 Roberts Oct 1996
US5595527 Texas Instruments Incorporated Appel et al. Jan 1997
US5667541 Minnesota Mining and Manufacturing Company Klun et al. Sep 1997
US5672097 Minnesota Mining and Manufacturing Company Hoopman Sep 1997
US5692950 Minnesota Mining and Manufacturing Company Rutherford et al. Dec 1997
US5725417* Micron Technology, Inc. Robinson Mar 1998
US5755614* Integrated Process Equipment Corporation Adams et al. May 1998
US5932486 Rodel, Inc. Cook et al. Aug 1999
US5958794 Minnesota Mining and Manufacturing Company Bruxvoort et al. Sep 1999
US5961372 Applied Materials, Inc. Shendon Oct 1999
US6224465* Meyer May 2001

Foreign Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
EP0348757MITSUBISHI MATERIALS SILICON CORPORATIONJan 1990
EP0439124MICRON TECHNOLOGY, INC.Jul 1991
WO199404599Mar 1994
* cited by examiner

Other Publications

“Microreplication Technology Meets Coated Abrasive Demands”, Gagliardi, John J.,
, “3m Fights Back,” Web Site, http://imsp008.netvigator.com/hkpa .../magazine/1996/960205/3mfight.html.
“Applied Microreplication: An Innovation in Coated Abrasives”, Gagliardi, John,
“3M uses a patented process of microreplication to produce new 3M structured abrasive belts”,
“Structured Coated Abrasives: A Whole New Approach”, Gagliardi, John J. and Mucci, Michael V.,
“Technological Innovation”,
“Polymeric Microstructure Technology”,

Patent Family

Document NumberAssigneeInventorsIssue/Pub Date
DE19828477 SPEEDFAM CORP MEYER STUART L Jan 1999
JP3078783 Aug 2000
US6224465 Stuart L. Meyer May 2001
US6497613 SpeedFam-IPEC Corporation Stuart L. Meyer Dec 2002