Filing Information

Inventor(s)	H. Peter W. Hey · Yezdi Dordi ·
Assignee(s)	Applied Materials, Inc. ·  View assignee updates
Attorney/Agent(s)	Moser, Patterson & Sheridan ·
Primary Examiner	Arun S. Phasge ·
Application Number	US9916365
Filing date	07/26/2001
Issue date	04/19/2005
Prior Publication Data	US20030019755 - 01/30/2003
Predicted expiration date	02/11/2022
Patent term adjustment	200
U.S. Classifications	205/87  · 205/291  · 205/103  ·
International Classifications	--
Kind Code	B2
International Classifications	205 87 · 205103 · 205291 ·

Patent Family

Abstract

A method for depositing a metal on a substrate is provided. The metal is deposited by sequentially applying a electrodeposition pulse followed by an electrodissolution pulse to the substrate. After each electrodissolution pulse an before the next electrodeposition pulse there is provided at least one time interval of zero electrical voltage or current, also known as an “off-time”, between the pulses. The first two electrodeposition pulses should preferably have the same time durations. Thereafter, the time durations of subsequent electrodeposition pulses are gradually decreased to provide a void-free and seam-free deposition of metal in high aspect ratio features.

Independent Claims | See all claims (21)

1. 1. A method for electroplating a metal on a substrate, comprising: sequentially applying two or more cycles comprising an electrodeposition pulse followed by an electrodissolution pulse to the substrate, wherein each electrodeposition pulse has a first time duration and each electrodissolution pulse has a second time duration equal to or less than the first time duration, and wherein the first time duration of each electrodeposition pulse of subsequently applied cycles is reduced.
2. 11. A method for electroplating a metal on a substrate having a trench, comprising the steps of: (a) sequentially applying two or more cycles comprising an electrodeposition pulse followed by an electrodissolution pulse to the substrate, wherein each electrodeposition pulse has a first time duration and each electrodissolution pulse has a second time duration equal to or less than the first time duration, and wherein the first time duration of each electrodeposition pulse of subsequently applied cycles is reduced; and (b) applying a DC current to the substrate to deposit the metal to a desired thickness on the substrate.
3. 21. A method for electroplating a metal on a substrate, comprising: sequentially applying two or more cycles comprising an electrodeposition pulse followed by an electrodissolution pulse to the substrate, wherein each electrodeposition pulse has a first time duration and each electrodissolution pulse has a second time duration equal to or less than the first time duration, wherein the first time duration is from about 500 milliseconds to about 3,000 milliseconds, and wherein the first time duration of each electroderosition pulse of subsequently aoolied cycles is reduced.