Join
today

Boliven PRO is more than just patent search

  • Build and save lists using the powerful Lists feature
  • Analyze and download your search results
  • Share patent search results with your clients

Patents »

US6881318: Dynamic pulse plating for high aspect ratio features

Share

Filing Information

Inventor(s) H. Peter W. Hey · Yezdi Dordi ·
Assignee(s) Applied Materials, Inc. ·
Attorney/Agent(s) Moser, Patterson & Sheridan ·
Primary Examiner Arun S. Phasge ·
Application Number US9916365
Filing date 07/26/2001
Issue date 04/19/2005
Prior Publication Data
Predicted expiration date 02/11/2022
Patent term adjustment 200
U.S. Classifications 205/87  · 205/291  · 205/103  ·
International Classifications --
Kind CodeB2
International Classifications 205 87 · 205103 · 205291 ·
21 Claims, 4 Drawings


Abstract

A method for depositing a metal on a substrate is provided. The metal is deposited by sequentially applying a electrodeposition pulse followed by an electrodissolution pulse to the substrate. After each electrodissolution pulse an before the next electrodeposition pulse there is provided at least one time interval of zero electrical voltage or current, also known as an “off-time”, between the pulses. The first two electrodeposition pulses should preferably have the same time durations. Thereafter, the time durations of subsequent electrodeposition pulses are gradually decreased to provide a void-free and seam-free deposition of metal in high aspect ratio features.

Independent Claims | See all claims (21)

  1. 1. A method for electroplating a metal on a substrate, comprising: sequentially applying two or more cycles comprising an electrodeposition pulse followed by an electrodissolution pulse to the substrate, wherein each electrodeposition pulse has a first time duration and each electrodissolution pulse has a second time duration equal to or less than the first time duration, and wherein the first time duration of each electrodeposition pulse of subsequently applied cycles is reduced.
  2. 11. A method for electroplating a metal on a substrate having a trench, comprising the steps of: (a) sequentially applying two or more cycles comprising an electrodeposition pulse followed by an electrodissolution pulse to the substrate, wherein each electrodeposition pulse has a first time duration and each electrodissolution pulse has a second time duration equal to or less than the first time duration, and wherein the first time duration of each electrodeposition pulse of subsequently applied cycles is reduced; and (b) applying a DC current to the substrate to deposit the metal to a desired thickness on the substrate.
  3. 21. A method for electroplating a metal on a substrate, comprising: sequentially applying two or more cycles comprising an electrodeposition pulse followed by an electrodissolution pulse to the substrate, wherein each electrodeposition pulse has a first time duration and each electrodissolution pulse has a second time duration equal to or less than the first time duration, wherein the first time duration is from about 500 milliseconds to about 3,000 milliseconds, and wherein the first time duration of each electroderosition pulse of subsequently aoolied cycles is reduced.

References Cited

U.S. Patent Documents

Document NumberAssigneesInventorsIssue/Pub Date
US6004188 Chartered Semiconductor Manufacturing Ltd. Roy Dec 1999
US6235625 Taiwan Semiconductor Manufacturing Co., Ltd. Lou May 2001
US6402924* Shipley Company LLC Martin et al. Jun 2002
US6524461* Faraday Technology Marketing Group, LLC Taylor et al. Feb 2003
US6551485* Faraday Technology Marketing Group, LLC Taylor Apr 2003
* cited by examiner

Patent Family